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AOI Chip layout - RWG 250 um cavity length, BH 300 um cavity length.ppt

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AOI Chip layout RWG 250 um cavity length BH 300 length
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Ridge Waveguide and Buried Heterostructure Laser Chip Layout,3-22-2012,Ridge Waveguide 250mm Cavity Length Chip,Bare Die Dimensions: (25010 μm) x (25010 μm) x (9510 μm),Ridge Waveguide 250mm Cavity Length Chip (Front view),2 µm,Contact metal thickness is 1.5 + 0.2 mm Laser beam location is ~3.3 + 0.2 mm below top of laser ridge,Buried Heterostructure 300mm Cavity Length Chip,Bare Die Dimensions: (30010 μm) x (25010 μm) x (9510 μm),,,,,,,,,,,Laser Ridge,Laser Beam,,9510 µm,,Buried Heterostructure 300mm Cavity Length Chip (Front view),Contact metal thickness is 1.5 + 0.2 mm Laser beam location is ~5.2 + 0.3 mm below top of laser ridge,,,,25010 µm,,,,,,,145 µm,
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